Mounting and Cooling - LP

Mounting and cooling considerations for the microDRIVE LP units.

Details and recommendations for mounting the units within a given application can be found below.

For the enclosed microDRIVE LP, four mounting holes (M2 suitable) are provided to attach the unit to your application securely. It is crucial to use the appropriate tightening torque suitable for the fastener and the type of mounting material being used.

While the microDRIVE is primarily intended for aerial vehicles, it is worth noting that implementing vibration isolation for the unit, especially in land-based applications, will significantly enhance its durability over time.

It is essential to incorporate adequate mechanical strain relief for all cables connected to the unit. This ensures appropriate support and protection against any undue stress or tension on the wires.

The following cooling considerations should be considered for the microDRIVE units.

The microDRIVE LP is supplied with a built-in housing that effectively meets the thermal management needs of the device. To fully utilise the 60A phase current rating in this setup, it is necessary to ensure a minimum airflow of 6m/s parallel to the heatsink (for a 25°C ambient air temperature).