microDRIVE LP/LPi Docs
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Integration
Mounting and Cooling

Mounting and Cooling - LP

mounting and cooling considerations for the micro drive lp units unit mounting details and recommendations for mounting the units within a given application can be found below microdrive lp for the enclosed micro drive lp, four mounting holes (m2 suitable) are provided to attach the unit to your application securely it is crucial to use the appropriate tightening torque suitable for the fastener and the type of mounting material being used while the micro drive is primarily intended for aerial vehicles, it is worth noting that implementing vibration isolation for the unit, especially in land based applications, will significantly enhance its durability over time it is essential to incorporate adequate mechanical strain relief for all cables connected to the unit this ensures appropriate support and protection against any undue stress or tension on the wires cooling considerations the following cooling considerations should be considered for the micro drive units microdrive lp the micro drive lp is supplied with a built in housing that effectively meets the thermal management needs of the device to fully utilise the 60a phase current rating in this setup, it is necessary to ensure a minimum airflow of 6m/s parallel to the heatsink (for a 25°c ambient air temperature)