 4LPi offers 6x M2 mounting holes to secure the unit to your cooling solution/aircraft. Ensure you use a tightening torque appropriate to the fastener and mounting material you are using. The mounting holes accommodate a head diameter/washer diameter of 4 mm [0.15in].

relies heavily on ensuring proper isolation. The bare board contains numerous exposed contacts, including a significant area of exposed live copper. This particular region serves to enhance thermal transfer, thus, establishing adequate electrical isolation for the board is imperative to prevent potentially hazardous short circuits. As a rule of thumb, there must be a minimum 0.6 mm [0.023 in] air gap between exposed contacts and any conductive materials in the mounting assembly. All direct contacts to the unit, especially the thermal interface materials (TIM), must be electrically insulative. Keep-out zones for the micro

 4LPi can be found in the CAD available from our 

 4LPi board should not be placed under high stress and torsional loads. The micro

 4LPi should be mounted in a floating arrangement.

 that raises the unit should be used to create the required air gap between the electronics and the mounting surface, as well as to allow airflow for passive cooling to take place.

 The diameter of the standoffs cannot exceed 5mm [0.19in] and should be at least 3.5mm [0.13in] tall to allow sufficient clearance between the components and the mounting surface. See the diagram below for details.

The displayed integration sled and heatsink are optional accessories for the micro

4LPi. These accessories will greatly reduce the airflow required to keep the unit cool and will assist in getting your vehicle operational sooner. 

The heatsink integration kit includes - 1x heatsink and 1x thermal tape solution, and the mounting sled integration kit includes - 1x mounting sled and 6x 

We recommend applying the thermal tape to the mico

 4LPi first, and then mounting the heatsink. Use firm pressure across the entire surface of the heatsink to ensure there is a good connection between the heatsink, the thermal tape and the board. The heatsink should be attached before mounting the board to your vehicle to avoid any flexing or bending as this could reduce the contact between the board and the heatsink.

Removal of thermal tape should be done using plastic tools to avoid scratching or otherwise damaging the electrical contacts of the board. 

 4LPi standalone, we recommend using our integration designs as a reference for how you should mount and cool the unit. CAD files for the sled and heatsink are available on request.

 4LPi is a bare-board smart power supply with exposed electrical connections. Contact with water or significant amounts of dust/particulate can result in unit failure. Ensure that the micro

 4LPi is mounted in a location with appropriate environmental protection to reflect the vehicle

The heat generating components on the micro

 4LPi are highlighted in the below drawing.

has a particularly high power density, making effective cooling a challenge. To ensure the micro

 4LPi can operate continuously at the required current, you need a cooling solution that can effectively dissipate the thermal power from the unit to ambient. 

This specific area to cool is identifiable by the presence of the exposed copper thermal transfer pad, as well as the five capacitors. To find power dissipation and temperature limit calculations, please consult the performance section our 

It is important to note that without any sort of heat-spreader solution to thermally connect components, the bus temperature sensor is thermally isolated from critical components and thus, may not provide accurate readings of the temperature of these components.

Mounting and Cooling